Chinese scientists create a revolutionary chip: memory thickness is one atom.

According to Korrespondent.net: Researchers from Fudan University in Shanghai have developed a hybrid chip that combines two-dimensional memory modules with a thickness of one atom with traditional silicon architecture. This message was published on the Notebookcheck website, referencing research in the journal Nature.

Atom2Chip Technology

The cutting-edge technology is based on the Atom2Chip system, which integrates a monolayer of molybdenum disulfide directly onto the surface of the CMOS chip. The thickness of the material is only one atomic layer. To protect it from damage, the team developed a special protection system and architecture that ensures communication between the two-dimensional circuits and the silicon base.

Chip Prototype

The created prototype is a NOR flash memory chip with a capacity of 1 kilobyte, which operates at a frequency of 5 megahertz. It is capable of performing reading, writing, and erasing operations based on external commands; the programming or erasing time is only 20 nanoseconds.

Development Prospects

The integration of two-dimensional materials with silicon structures helps overcome physical limitations in the further miniaturization of semiconductors. Traditional silicon technology has already reached its limit in reducing transistor sizes, while two-dimensional materials open up new possibilities for creating ultra-thin and powerful electronic components.

According to researchers, this technology has the potential to become the foundation for a new generation of processors and chips, combining high performance with compactness.

In addition, it was recently reported that Samsung plans to release a next-generation 512 TB storage drive in 2027.

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The development of the hybrid chip indicates a new stage in memory technologies that could revolutionize electronics. The use of two-dimensional materials may contribute to the reduction of device sizes while simultaneously increasing their performance. This opens doors not only for new products but also for the enhancement of existing technologies.